Danny Naz says the memory upcycle will last beyond a single quarter as AI demand drives a multiyear buildout. He points to HBM packaging expansion in early 2027, new DRAM capacity through 2027-28, NAND after that, and New York wafer output only by 2030.
published
Danny Naz says the memory upcycle will last beyond a single quarter as AI demand drives a multiyear buildout. He points to HBM packaging expansion in early 2027, new DRAM capacity through 2027-28, NAND after that, and New York wafer output only by 2030.
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